3D Glass Solutions, Inc-

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Current Open Positions

Controller
Thin Films Engineer
Yield Engineer
Process Engineer Rotational Program
Accounting Manager
Group Leader – Wire Bond & Mold
Group Leader – SMT
Group Leader – End of Line
Group Leader – Die Prep & Dicing
Group Leader – Die Attach & Underfill
Equipment Maintenance Technician
Chemical and Materials Engineer
Electroplate Engineering Manager
Thin Film & Etch Engineering Manager
RF Test Engineer
Group Leader – Wet Etching (TGV & Cu)
Senior Process Engineer – Electroless Copper
Senior Process Engineer – DFR Developer & Stripper
Senior Process Engineer – Cleaning Processes
Copper Plating Engineer
Reliability & Yield Engineering Manager
Copper Plating Engineering Group Leader